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Designs and implements top-level physical design for AI-focused semiconductor chips, collaborating with cross-functional teams to meet strict performance, power, and area targets.
Designs and automates chip design flows for semiconductor connectivity solutions, using Python, Tcl, and EDA tools to optimize RTL generation and hardware development.
Designs and implements advanced semiconductor packages for high-performance AI connectivity chips, collaborating with teams to optimize electrical, thermal, and mechanical performance from concept to production.
Senior/Staff STA Engineer at Astera Labs in Israel designs and signs off timing for high-performance AI connectivity chips, using EDA tools and SDC constraints to meet aggressive data-center targets.
Leads the full lifecycle of ASIC chip development for AI infrastructure, coordinating cross-functional teams to design, fabricate, and validate semiconductor solutions.
Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the…
Designs power integrity and electromigration checks for AI-focused semiconductor chips, using tools like Ansys RedHawk and Cadence Voltus to ensure reliability in advanced FinFET nodes.
Principal Architect at Astera Labs in Tel Aviv designs high-performance AI connectivity solutions, focusing on PCIe, Ethernet, and advanced interconnect protocols like CXL and UALink.
Designs and implements verification environments for high-performance semiconductor chips in AI infrastructure, using SystemVerilog/UVM to validate digital blocks and subsystems.
Designs and automates semiconductor chip implementation flows, focusing on parasitic extraction and GenAI-driven methodologies to optimize high-speed AI connectivity chips from RTL to GDSII.
Designs power integrity and electromigration solutions for high-performance AI chips, ensuring voltage stability and reliability in advanced semiconductor nodes.
Leads engineering operations and ASIC tapeout management for a semiconductor company, driving decision velocity and execution rigor in San Jose, CA.
Leads the design and implementation of high-performance digital circuits for AI connectivity chips, using PCIe, CXL, Ethernet, and DDR protocols, from architecture to silicon bring-up.
Junior Physical Design Engineer at Astera Labs in Tel Aviv builds and optimizes semiconductor chips for AI infrastructure, focusing on physical implementation, signoff, and automation using RTL-to-GDS flows and EDA tools.
Designs and implements digital blocks for semiconductor chips powering AI infrastructure, using Verilog/SystemVerilog and RTL coding principles with industry EDA tools.
Leads a team in Hyderabad to design and implement high-speed connectivity ASICs for AI infrastructure, using advanced EDA tools and flows for full-chip physical design and tapeout.
Leads a team to verify complex semiconductor designs for AI infrastructure, focusing on PCIe, CXL, and UVM methodologies to ensure silicon success.
Leads a team to verify next-generation AI infrastructure SoCs using UVM, formal methods, and emulation, ensuring first-pass silicon success for complex designs in compute and networking.
Leads post-silicon engineering programs for AI connectivity ASICs, coordinating silicon bring-up, validation, and manufacturing release across cross-functional teams.
Leads cross-functional ASIC development programs from planning through tapeout, coordinating RTL design, verification, physical design, and external partners to deliver custom silicon for AI infrastructure.
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