AMD
American multinational semiconductor company
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4 views 7 days ago
Technical Program Manager, Thermal & Mechanical Engineering
New APAC, North America
At AMD in Penang, Malaysia, this Technical Program Manager leads thermal, mechanical and advanced board-assembly (SMT/large BGA) development programs from requirements through qualification, manufacturing release and production ramp, coordinating package, board, cooling and chassis integration across global engineering and supplier teams.
Acceptance Criteria AI Assembly FMEA GPU +7 skills
126K – 180K MYR 6 views 7 days ago
Staff Package Design Engineer
New APACStaff
Malaysia
ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies…
AI Ansys Assembly Automation Design for Manufacturing (DFM) +3 skills