AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
4 jobs
3 weeks ago
Package Design Engineer
Open 22d APAC
Designs high-performance flip-chip BGA packages for ASICs used in AI, networking, HPC, and 5G, focusing on SerDes, RF/microwave, and signal/power integrity.
ai hpc networking
3 weeks ago
Analog/Mixed Signal IC Design Engineer
Open 22d APAC
Designs high-speed analog and mixed-signal circuits for advanced CMOS nodes (2nm/3nm) using Cadence Virtuoso, targeting AI, HPC, and data-center markets.
cadence-virtuoso machine-learning matlab