Phizenix
Open positions
1 job
4 views 3 weeks ago
System & Advanced Packaging Design Lead
Open 20d HybridNorth AmericaContractLead 1 question
United States
Santa Clara, CALead advanced 2.5D/3D/chiplet packaging and signal/power integrity for 200G+ copper interconnects and co-packaged optics (drivers, TIAs, micro-LED) in AI data-center hardware at Phizenix. Day to day: substrate stackup and routing design, EM/channel simulation (HFSS, ADS), thermal/PDN signoff, JEDEC qualification, OSAT/vendor management, and lab correlation.
AI Cmos Fiber SerDes Signal Integrity
180K – 200K $