1.與技轉單位共同完成電路商品化 2.參與高速EIC電路設計: TIA/LA/CML Driver 3.進行Transistor-Level Design/Simulation/Layout Review 4.EIC TIA 晶片驗證/Board Bring-up/Optical Link Measurement 5.協助進行：PD + TIA整合驗證 6.參與與學校技轉團隊合作開發
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