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英屬開曼群島商世芯股份有限公司台灣分公司

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英屬開曼群島商世芯股份有限公司台灣分公司
2 views 2 weeks ago

Sr. Substrate Design Engineer

APACSenior
Taiwan
Zhubei City, Hsinchu County

1. Flip chip package substrate design, and 2.5D experience is a plus. 2. Provide optimization design proposal. 3. Co-work closely with substrate suppliers/SIPI team directly. 4. Design rule maintenance.