2027 Campus - Package Architect

MediaTek is the world’s fifth largest fabless IC design company, offering a diverse range of products for AI, smartphones, smartwatches, tablets, WiFi, TV, Automotive, data center processing and interconnect, voice assistant devices, drones, navigation systems and so on, most of which have the biggest market share in the world. At MediaTek, we foster a diverse and supportive culture that empowers employees to achieve their ultimate potential. We are ranked second in Newsweek's 2024 list of the World's Most Trustworthy Companies for Technology Hardware and one of Forbes’ World’s Best Employers 2024.

Are you a recent graduate with a passion for cutting-edge technology? Do you dream of working on groundbreaking projects that shape the future of data centers, AI, and high-performance computing? If so, we have an exciting opportunity for you! Our Data Center Product Architecture and Technology team is at the forefront of innovation, developing state-of-the-art architecture and technology solutions for data centers that power cloud infrastructure and the rapidly growing AI industry. We are a fast-growing, dynamic team dedicated to pushing the boundaries of technology.

Location: San Jose, California (on-site) or Portland, Oregon (on-site)

Job Description

• Develop and evaluate packaging solutions for next generation data center and AI silicon products.
• Signal and Power integrity analysis for high speed interfaces. Power deliver network design and analysis for next generation XPUs.
• Collaborate with cross functional teams to improve packaging solution in key vectors including performance and form factor.
• Understand Industry and technology trends.

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Requirement

• Student graduated after December 2026 or in 2027 with a M.S. or higher degree in Electrical Engineering or a related field in Physics.
• Solid understanding of VLSI package design and silicon interactions.
• Experience with transient and frequency domain analysis.
• Good understanding of silicon packaging and deep submicron silicon process
• Proficient with package layout tool (e.g. Cadence Allegro) and SI/PI tools (e.g Ansys HFSS).
• Able to assume responsibility for a variety of technical tasks and to work independently
• Excellent working attitude and good interpersonal and communication skills.

Salary range: $122,000- $213,000
Employee may be eligible for performance bonus, short and long term incentive programs. Actual total compensation will be dependent upon the individual's skills, experience and qualifications. In addition, MediaTek provides a variety of benefits including comprehensive health insurance coverage, life and disability insurance, savings plan, Company paid holidays, Sick Leave, Vacation time, Parental leave, 401K and more.
MediaTek is an Equal Opportunity Employer that is committed to inclusion and diversity to all, regardless of age, ancestry, color, disability (mental and physical), exercising the right to family care and medical leave, gender, gender expression, gender identity, genetic information, marital status, medical condition, military or veteran status, national origin, political affiliation, race, religious creed, sex (includes pregnancy, childbirth, breastfeeding and related medical conditions), and sexual orientation.
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