5 days Application / Process Engineer (Die Bond Tools) up to $6000
Summary
Engineer die-bonding processes and equipment for semiconductor packaging, optimizing yield and troubleshooting issues while collaborating with cross-functional teams.
Application / Process Engineer (Die Bond Tools)
$3,000 – $6,000
Monday – Friday, 9:00am – 6:00pm
Woodlands
Job Responsibilities
- Develop, optimize and validate die bonding processes, applications and equipment.
- Set up, calibrate and qualify machines to achieve optimum performance and production yield.
- Troubleshoot equipment and process issues, and implement corrective actions.
- Develop process recipes, test procedures and technical documentation.
- Work closely with R&D, Software, Mechanical, Electrical, Manufacturing and Quality teams to improve products and processes.
- Provide technical support, equipment installation and application support at customer sites.
- Conduct customer training and support Field Application Engineers on equipment operation.
- Liaise with customers to understand application requirements and recommend suitable semiconductor packaging solutions.
- Gather customer feedback and work with the R&D team on product improvements.
Requirements
- Bachelor's or Master's Degree in Mechanical, Electrical, Materials Engineering or a related discipline.
- Semiconductor manufacturing experience is required.
- Minimum 3 years of experience in semiconductor packaging, die bonding equipment or advanced electronics manufacturing.
- Good knowledge of advanced semiconductor packaging technologies (e.g. Flip Chip, PoP, WLP and PLP).
- Experience with semiconductor equipment, motion control systems and process development is an advantage.
- Hands-on troubleshooting and problem-solving experience in a manufacturing or laboratory environment.
- Good communication skills and able to work independently as well as in a team.
- Willing to travel for customer support, equipment installation and on-site technical assistance when required.
Company Name: Talent Recruitment Pte Ltd
EA License No: 24C2338
EA Personnel Name: Loke Sai Lye (Loke)
EA Personnel No: R24123366
Email: loke.dexter@talentrecruitmentsg.com
Contact Number: 8168 8648