6723 - Senior TCB Process Engineer | $8K–$10K | Semiconductor | Admiralty | HBM & Chiplets

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB)

Location: Admiralty
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : SGD 8,000 – SGD 10,000/month (Based on experience and technical capability).

Responsibilities:

Customer Application Engineering

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.

Advanced Packaging Process Development

-Develop and support applications involving:

• Thermo Compression Bonding (TCB)
• Flip Chip Assembly
• Hybrid Bonding
• HBM Packaging
• CoWoS
• CoPoS
• 2.5D Packaging
• 3D Packaging
• Chiplet Integration
• Large Die Packaging

-Evaluate and optimize:

• Bond force
• Temperature profiles
• Process windows
• Alignment accuracy
• Package warpage
• Yield
• Reliability

Equipment Development

-Work closely with multidisciplinary engineering teams to define:

• Machine architecture
• Functional specifications
• Accuracy requirements
• Throughput targets
• Thermal performance
• Bonding process capability
• Reliability requirements
• Customer acceptance criteria

Provide technical guidance throughout equipment development.

Machine Qualification

Serve as the internal customer during equipment development.

Responsibilities include:

• Defining machine acceptance criteria
• Process qualification
• FAT and SAT support
• Customer buyoff support
• Qualification reporting
• Continuous performance improvement

Technology & Market Intelligence

Monitor industry developments in:

• Advanced packaging technologies
• Semiconductor manufacturing trends
• Customer requirements
• Competitor equipment
• Emerging packaging architectures

Support future product strategy and technology roadmap planning.

Requirements:

- Bachelor's or Master's Degree in:

• Materials Engineering
• Mechanical Engineering
• Electrical Engineering
• Chemical Engineering
• Physics
• Semiconductor Engineering
• Related Engineering disciplines

-Minimum 5 years experience in semiconductor advanced packaging.

-Hands-on experience in one or more of the following:

• Thermo Compression Bonding (TCB)
• Advanced Packaging Process Development
• Flip Chip Assembly
• New Product Introduction (NPI)
• Process Qualification
• Equipment Qualification
• Manufacturing Engineering
• Customer Process Development

- Experience supporting advanced package technologies such as:

• HBM
• CoWoS
• CoPoS
• Chiplets
• 2.5D Packaging
• 3D Packaging
• Large Die Packaging

- Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.

- Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply.

- Strong understanding of:

• Thermo Compression Bonding (TCB)
• Semiconductor Packaging
• Flip Chip Assembly
• Process Qualification
• SPC
• DOE
• Yield Improvement
• Reliability Testing
• Failure Analysis
• Package Warpage
• Thermal Management
• Alignment Accuracy
• Semiconductor Manufacturing Processes

- Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.

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  📲Interested candidates, please WhatsApp your resume to: +65 9642 0989 (Han) 📧 Or email your resume to: supreme.cc.han@gmail.com

  👤Chaw Chiaw Han | R22106723🏢 The Supreme HR Advisory Pte Ltd | EA 14C7279