Advanced Package Development Engineer
Join the team behind the technology in a billion pockets worldwide. Apple's Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation products. In this role, you'll contribute to the advanced packaging technologies that enable Apple's industry-leading silicon performance. You'll work alongside world-class engineers to solve complex integration challenges and bring new packaging innovations from concept to mass production.
Developing advanced packaging technologies in a cross-functional team. You will be responsible for Package integration and technology development.
We're looking for someone who: • Has deep expertise in semiconductor packaging or related disciplines • Thrives on solving difficult technical problems • Holds themselves to a high standard of engineering excellence • Is self-motivated and comfortable navigating ambiguity
Minimum Qualifications
- BS and 10+ years of experience in relevant industry experience.
Preferred Qualifications
- PhD and 6+ years of experience in relevant industry preferred.
- Silicon fab interconnect process integration experience in BEoL process, RDL, fine pitch μ-bumps, hybrid bonds, TSVs, etc.
- Deep knowledge of electrical, mechanical and thermal properties of fab materials.
- Strong expertise in Si Fab equipment and Fab Logistics Management.
- Experience on advanced packaging for groundbreaking CMOS nodes.
- Expertise on Si structure yield and reliability mechanisms and analyses.
- Good familiarity with electrical, mechanical and/or thermal characterization, failure analysis.
- Tool experience: One or more of TCAD, JMP, Virtuoso, KLayout, Ansys EDT.
- Capable of independent R&D Work in a cross-functional team, driving vendors.
- Excellent communication skills.
- Experience in Si fab integration role and advanced packaging.