Advanced Package Technology Development Process Integration Engineer 先進封裝製程整合研發工程師, R&D
Posted Updated 1
view
台灣美光(台灣美光記憶體股份有限公司/美商美光亞太科技股份有限公司台灣分公司) Advanced Package Technology Development Process Integration Engineer 先進封裝製程整合研發工程師, R&D
Description
RESPONSIBILITIES
- Analyze and resolve cross-process (Process-to-Process) integration issues to ensure seamless operation.
- Optimize process conditions and overall yield performance, contributing to our world-class standards.
- Collaborate closely with process, equipment, product, and manufacturing teams to ensure the successful implementation of new technologies into mass production.
- Develop and maintain comprehensive process flow and window to guarantee product stability and consistency.
- Lead root cause analysis and develop improvement plans for complex issues.
REQUIREMENTS
- Proven experience in process integration within the semiconductor or related industry.
- Strong analytical and problem-solving skills, with the ability to strictly determine root causes and implement effective solutions.
- Excellent collaboration and communication skills to work effectively across diverse teams.
- Ambitious and driven to achieve outstanding results in a competitive environment.
- Bachelor's degree in Engineering or a related field, or equivalent experience; advanced degree preferred.
歡迎身心障礙/神經多樣性人才投遞
美光身心障礙人才友善職涯入口: https://tw.micron.com/about/careers/people-with-disabilities