Advanced Packaging & Process Integration Engineer – Leading R&D Organization

Our client is a well-established research and technology organisation, focusing on advanced R&D and the development of next-generation semiconductor technologies.

We are looking for an Advanced Packaging & Process Integration Engineer to support the research and development of advanced semiconductor packaging and heterogeneous integration technologies.

Position: Advanced Packaging & Process Integration Engineer
Employment Type: Full Time, Permanent
Location: Singapore

Responsibilities:

• Research and develop fine-pitch flip-chip and hybrid bonding technologies
• Develop Chip-to-Wafer and Wafer-to-Wafer bonding processes
• Support interposer and hybrid bond pad fabrication and process integration
• Optimise bonding materials, surface preparation and process parameters
• Conduct engineering experiments, process optimisation and data analysis
• Improve process yield, performance and reliability
• Support 2.5D / 3D heterogeneous integration technology development
• Collaborate with internal teams and external partners on R&D projects

Requirements:

• Bachelor’s Degree in Materials, Mechanical, Chemical, Electronics, Electrical, Computer Engineering or related discipline
• 1–6 years of relevant experience in microelectronics, semiconductor or component integration
• Experience in advanced packaging / process integration is preferred
• Hands-on experience in flip-chip bonding will be advantageous
• Knowledge of hybrid bonding equipment and materials is advantageous
• Experience in process development, data analysis and DOE preferred
• Good analytical, problem-solving and communication skills

**Interested candidates, kindly email updated resume to sandra@wanco-manpower.com with Subject of "Advanced Packaging & Process Integration Engineer", thank you.