Advanced Process & Package Technology Development Engineer/Technical Manager

1. Advanced process technology development
2. Advanced package technology development

#LI-JK1

1. 7nm/5nm/3nm/2nm advanced technology research/development experience
2. Advanced device technology development (semiconductor device physic)
3. Advanced YE & FA technology development (IP test chips Tape-out, DRC review, diagnosis, failure analysis, material analysis)
4. Advanced new product introduction technology development (1st NTO product Tape-out, DRC review, DOE and corner plan, yield analysis, MP window)
5. Advanced Chiplet and 3DIC package technology development
6. Foundry working experience >5years