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英屬開曼群島商世芯股份有限公司台灣分公司

Assembly Packaging Engineering Manager

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Description

1. Provide IC package solution supporting pre-sales activity; timely respond package inquiries.
2. Collaborate with subcontractor's engineering team and IC designer to deliver robust package solutions.
3. Participate IC package substrate design, design review; initiate package specs and documentation.
4. Work with DE/SIPI/PM, subcontractor for prototype build, package characterization and simulation.

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