Associate Engineer (Sputter / Photolithography / Descum)
Summary
Maintains and improves semiconductor fabrication equipment like sputter, photolithography, and descum machines in a high-volume wafer bumping line.
Responsibilities;
- Line sustaining for dry process (i.e. Sputter, Photolithography and Descum)
- Support lot dispositions and OCAP executions
- Involve in Continuous Improvement Projects
- Working with QM Dept. to response customer inquires and issues
- Execute CIP or project handling that contributes yield & cost efficiency improvement
- Ensure SPC is maintain and in control
- Support new material evaluation and new tool set up
Requirements;
- Diploma in electronics or related disciplines
- Preferably with minimum 2 years' experience in Wafer bumping process running high volume
- Knowledge in: Statistic Process Control (SPC), Out Of Control Procedure (OCAP)