半導體_IC封裝設備工程師(常日班)-擴廠需求
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Description
1.Assy Die Bonder設備or Printing相關維修經驗
2.Assy Ball Placement or Reelow 設備相關維修經驗
3.設備異常分析改善&效能提升與優化評估
4.G8D Report & SOP edit
See also
Industrial Engineering jobs by country — openings, pay and top skills →