半導體檢測設備開發光學設計工程師Semiconductor Inspection Systems Optical Design Engineer_台達研究院(新竹)

研發半導體先進封裝檢測與光學量測設備、高速顯微成像與多光譜照明模組等，以及相關幾何／波動光學模擬、光機系統公差分析模型建立、高深寬比結構光學繞射模型建立、亞微米級缺陷特徵重構與 3D 表面輪廓量測演算法

Develop semiconductor advanced packaging inspection and metrology equipment, high-speed microscopic imaging, and multispectral illumination modules. Establish geometric and wave optics simulations, optomechanical tolerance analysis models, optical diffraction models for high-aspect-ratio structures, and algorithms for sub-micron defect feature reconstruction and 3D surface profile metrology

本職缺主要工作內容:
1.先進成像光路系統設計，檢測成像光路評估、規格制定與光機公差分析
2.光機系統公差模型建立、光學繞射與波動光學模型建立、熱光效應與波前像差校正模型建立
3.先進封裝（如 CoWoS / Hybrid Bonding）檢測與 3D 表面輪廓量測之光機電整合與應用系統開發
4.高速顯微取像系統、多光譜/明暗視野照明模組與光機硬體架構開發
5.模組化光學檢測次系統架構設計與產線自動化量測整合開發

1.Design advanced imaging optical systems, evaluate inspection imaging optical paths, define system specifications, and perform optomechanical tolerance analysis
2.Build optomechanical tolerance models, optical diffraction and wave optics models, and models for thermo-optic effects and wavefront aberration correction
3.Develop optomechatronic integration and application systems for advanced packaging (e.g., CoWoS / Hybrid Bonding) inspection and 3D surface profile metrology
4.Develop high-speed microscopic imaging systems, multispectral/brightfield/darkfield illumination modules, and optomechanical hardware architectures
5.Design modular optical inspection subsystem architectures and develop integrated solutions for in-line automated metrology