半導體檢測設備開發軟體設計工程師Semiconductor Inspection Systems Software Design Engineer_台達研究院(新竹)

研發半導體先進封裝檢測與光學量測設備之核心應用軟體、影像處理與演算法系統，涵蓋高速顯微取像控制、多光譜照明驅動、微結構光學特徵提取、亞微米級缺陷重構與 3D 表面輪廓量測演算法開發，並實現軟硬體整合與自動化量測流程

Develop core application software, image processing, and algorithm systems for semiconductor advanced packaging inspection and metrology equipment. Encompass high-speed microscopic imaging acquisition control, multispectral illumination driving, microstructure optical feature extraction, sub-micron defect reconstruction, and 3D surface topography metrology algorithm development, realizing seamless hardware-software integration and automated measurement workflows.

本職缺主要工作內容:
1.半導體光學檢測演算法開發：亞微米級微缺陷特徵提取、影像特徵重建、散斑抑制與訊雜比最佳化
2.3D影像重建與形貌量測演算法開發：3D/CT影像重構、雜訊濾除、干涉條紋分析、共軛焦成像運算或高深寬比結構光學特徵反演模型實作
3.設備控制軟體與高速取像整合：相機驅動、即時影像擷取、多軸運動控制（Motion Control）與自動對焦（Auto-focus）閉迴路控制整合
4.模組化量測架構與軟體系統開發：設計模組化、高穩定度之檢測次系統軟體，建立標準通訊與產線自動化量測流程
5.先進封裝（如 CoWoS / Hybrid Bonding）應用軟體落地：協同光機電團隊進行設備整合調校、系統驗證與效能最佳化

1.Semiconductor optical inspection algorithm development: Sub-micron defect feature extraction, image feature reconstruction, speckle suppression, and SNR optimization
2.3D image reconstruction and topography metrology algorithm development: 3D/CT image reconstruction, noise filtering, interferometric fringe analysis, confocal imaging computation, and optical feature inversion modeling for high-aspect-ratio structures
3.Equipment control software and high-speed acquisition integration: Camera driver integration, real-time image capture, multi-axis motion control, and closed-loop autofocus integration
4.Modular metrology architecture and software system development: Design modular, high-stability inspection subsystem software; establish standardized industrial communication protocols and in-line automated metrology workflows
5.Application software deployment for advanced packaging (e.g., CoWoS / Hybrid Bonding): Collaborate with optomechanical and electrical teams on system integration, calibration, validation, and performance optimization