常日班-半導體封裝D/B製程工程師
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Description
1.晶元(wafer)研磨、切割,Package 切割及D/B方法之製定
2.熟悉QC手法及實驗計劃
3.規格(OID)建立或更改
4.產線工程及品質問題解決
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