D002-4 Application Engineer - Bonder｜Hsinchu/Taichung

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Key Responsibilities:

• Lead and drive the qualification, process development, trouble-shooting, characterization of advanced chip/wafer bonding/de-bonding processes for SUSS products to ensure competitive edge of processes performance for customer demands in the domain fields of 3D advanced semiconductor, e.g. SoIC, CoWoS, InFO, BSPDN
• Improve the yield of process characteristics by analyzing process symptom data and performing for expertise documentation of technique to conduct 3D processes enhancement for sophisticated technical projects and events
• Act as the primary point of contact for on field key customers, manage multi-disciplinary projects and technical tasks of R&D or HVM from concept to completion, ensuring milestones on time and within planning scope
• Co-worker with the team to cultivate the continuous BKM techniques knowledge stewardship, accelerating the team's technical proficiency
• Take accountability and ownership of critical tasks and projects assigned by supervisor

Requirements:

• Education of Master or beyond in engineering background for Physics, Optics, Material Science, Mechanical Engineering, Electrical Engineering
• 6+ years of proven experience in wafer fab working, specifically in 3D wafer process engineering or field applications
• Deep technical proficiency with chip/wafer bonder/de-bonder and sophistic knowledge with 3D semiconductor or advanced packaging domains
• Demonstrated experience in managing complex projects or tasks
• Analytical skills, self-motivated, resilience characteristics with good accountability