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MediaTek

<Data Center> Advanced Package Engineer/ Technical Manager

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Description

1. CoWoS and 2.5D package technology development
2. 3D package technology development
3. CPC/CPO package technology development
4. Mobile/WiFi/TV/Automotive package development
5. Package technology integration and NTO handle
6. Package design/SIPI/Layout
7. Package Modeling

#LI-JK1

1. Advanced package technology, design, modeling, including but not limited to CoWoS/2.5D/3D/CPC/CPO
2. Package technology integration and NTO handle experience
3. Packaging experience >6 years

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