<Data center>Chiplet integrator

1. Familiar to 2.5D or 3D PKG integration & development & mass production experience
2. From chip architecture view to propose best-fit PKG technology with SIPI, testing, thermal consideration

Requirements

1. Understanding TSMC, INTEL, OSAT 2.5D PKG technology
2. Understand TSMC, INTEL 3D PKG technology
3. Experience on chiplet architecture with integration flow
Education: Master's Degree