<Data Center> Sr./ Staff Rack Thermal & Mechanical Architect

About the Role
We are seeking Rack Thermal & Mechanical Architects to own how the AI rack is cooled, built, shipped and serviced at high density. You will define the air- and liquid-cooling architecture (cold plates, CDU, manifolds, quick disconnects) and own the chassis, rack structure and rack/container packaging. You will also support thermal and mechanical integration of the xPU, compute tray, NVLink switch trays, cable cartridge and busbar with the domain architects. The three positions span both thermal and mechanical disciplines and work closely with third-party ODM, cooling and rack vendors and CSP/OEM customers to drive co-engineering.

Key Responsibilities

• Cooling architecture: Own air-cooled and liquid-cooled designs (direct-to-chip, hybrid air/liquid, liquid-to-air).
• Liquid-cooling hardware: Specify cold plates, in-rack/in-row CDU, manifolds, quick disconnects and hoses.
• Thermal modeling: Run CFD and flow-network analysis for flow rate, pressure drop and heat rejection.
• Leak & coolant: Define leak detection, coolant quality, filtration and fail-safe response.
• Chassis: Own chassis and tray mechanics; support xPU and compute-tray thermal solutions.
• Rack structure & packaging: Own rack frame, weight, floor loading, seismic, rack/container packaging and transport.
• Fabric & power mechanics: Support mechanical integration of NVLink switch trays, the cable cartridge/CPC and busbar.
• Serviceability: Blind-mate connections, hot-swap trays, cable routing and airflow management.
• Validation & facility: Define thermal, flow, leak and burst tests; align with facility water systems (TCS/FWS).

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Required Qualifications

• Education: BS/MS in Mechanical Engineering, Thermal/Fluid Sciences or related field.
• Experience: 8+ years in thermal and mechanical design for high-density datacenter systems.
• Liquid cooling: Direct-to-chip cooling for high-power xPUs and 100 kW+ racks.
• Analysis tools: CFD (e.g., Icepak, FloTHERM, Fluent) and FEA structural analysis.
• CAD: Creo, NX or SolidWorks for rack, chassis and tray design.
• Standards: ASHRAE TC9.9 and OCP cooling and rack guidelines.
• Collaboration: Strong supplier and cross-functional collaboration.

Preferred Experience

• Seismic, transport and packaging qualification of rack-scale products.
• CDU design or facility-side liquid cooling experience.
• Hands-on lab testing of cold plates and manifolds.
• DFM experience with rack integrators.

Key Interfaces
Rack System Architect; AI Server Platform Architect (xPU/tray thermal, chassis); Rack Power Architect (liquid-cooled busbar); AI Rack Network Architect (switch trays, cable cartridge); Technical Project Manager (packaging/logistics); cooling and rack vendors; facility teams.