<Data center>Technology Engineer(3.5D methodology)

1. Develop 3.5D methodology from RTL to GDS and Package
2. Coordinate Thermal and PI/SI team to deal with high power design
3. Execute the project at different phases

Requirements

1. Advance process or package design experience
2. Better to have 3.5D design experience
3. Better to have experiene in large scale and high power design
4. Good communication skill in English