Design Enablement & Tapeout Operations

Summary

Supervise the full tapeout process—from customer engagement and DRC review to GDS/jobview release—while supporting PDK development with EPDA vendors like Cadence, Siemens-Mentor, Ansys-Lumerical, and Luceda in a silicon photonics foundry environment.

Role and Responsibilities

  • Supervise tapeout process from customer engagement to final jobview release.
  • Resolve customer queries during their design process.
  • Oversee DRC review, waiver & approval, GDS preparation & floorplanning for tapeout.
  • Co-ordinate tapeout logistics with foundry TD, customer engineering.
  • Oversee jobview and MEBES approval / release for tapeout.
  • Verify component performance against design target.
  • Si photonics design to enhance PDK elements for Design for Manufacturing (DFM).
  • Support PDK development with Designer and Electronics Photonics Design Automation (EPDA) vendors like Ansys-Lumerical, Siemens-Mentor, Cadence or Luceda.
  • Maintain & upgrade PDK to enhance competitiveness.
  • Support CompoundTek Technology roadmap with design services

Qualifications and Education Requirements

  • PhD/Master/Degree in Microelectronics/Electrical/Electronic Engineering/Physics/Material Science.
  • At least 5 years relevant experience in Design Enablement and / or Tapeout Operations working with foundry customers.
  • Si photonics knowledge preferred but not mandatory.
  • Good interpersonal, effective presentation and communication skills.

Additional Attributes

  • Exhibit Initiative, ownership, accountability and a team player.
  • Able to perform under a fast paced and challenging environment.
  • Demonstrate strong problem-solving skills.

See also

Design jobs by country — openings, pay and top skills →

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