【電路設計類】熱應分析工程師 (ME) (Mechanical Engineering)

1. Package model behavior exploration for warpage and crack by using Ansys mechanical simulation.
2. amelioration by using Ansys optimization algorithm.
3. Thermal dissipation for CFD and coupling-dimensional domains simulation for Joule heat or electromigration / electrophoresis pathfinding.
4. PCB / Substrate / Package physical modeling and simulation optimization for reliability quality.