電子工程師 Senior Principal Engineer

Key Responsibilities
Hardware Architecture & Product Development
Own the complete hardware design lifecycle from concept through production and sustaining engineering.
Translate product requirements into hardware architectures and detailed design specifications.
Conduct technology evaluations, design trade-off analyses, and recommend optimal solutions.
Select and qualify key components, technologies, and vendors.
Drive product lifecycle management (PLM) activities, including product introduction, production release, field support, and post-launch analysis.

Design & Development
Design complex multi-layer PCBs for networking and security appliances.
Perform circuit design, schematic capture, signal integrity analysis, and power budget calculations.
Develop PCB stack-ups and controlled impedance requirements for high-speed interfaces.
Create and maintain Bills of Material (BOMs), design documentation, ECOs, and change notices.
Validate designs through prototyping, characterization, functional testing, and root cause analysis.

Documentation & Manufacturing Support
Develop technical documentation including product specifications, test plans, manufacturing instructions, and validation procedures.
Ensure compliance with engineering standards, regulatory requirements, and customer expectations.
Provide technical guidance and support to contract manufacturers throughout prototype and production builds.
Collaborate closely with suppliers and vendors for component selection, qualification, and issue resolution.

Cross-Functional Collaboration
Partner with CAD engineers on PCB layout and routing optimization.
Work closely with firmware and software teams during board bring-up, debugging, and system integration.
Participate in design reviews and provide technical leadership across engineering organizations.

職責：
-負責整個硬體設計過程，包括產品規格、佈局說明、材料清單(BOM)的創建、測試程序等。 在製作和生產階段為製造商提供技術支持件，確保產品符合工程規範、法規和客戶期望。
-與軟體工程師合作進行確認測試和除錯。

要求：
-具備x86 Intel、AMD、ARM和MIPS處理器的嵌入式系統設計經驗
-熟悉802.3以太網標準和無線802.11標準文件並具備從硬體和軟體的角度設計高速度介面的產品的經驗
-具備可製造性設計（DFM）的產品級整合經驗
-具有設計驗證和根本原因分析能力文件有使用實驗室設備（邏輯分析儀、頻譜分析儀、示波器等）經驗
-具備設計具有安全特徵的產品的知識和經驗，例如TPM、TRNG等
-具備Cadence CIS和Allegro的經驗
-能夠準備關鍵交付文件，如BOM、報價、原理圖、設計/測試文件、元件請求/資格認證、ECO等
-具備良好的口頭和書面溝通能力