電子硬體工程師/主管

• Camera module design
• ARM based SoC system design using nVidia, Ambarella, NXP, QUALCOMM platform.
• Edge AI camera design integrated with 2D/3D camera, Wifi, PoE, Display and battery.
• 硬體研發及測試技術:

1. 硬體線路設計驗證及除錯
2. 高速數位訊號量測及分析 (MIPI-CSI or DSI, Wi-Fi or BLE 4.0)
3. PCB Layout檢查及驗證
4. BOM表建立與檢察
5. 其他主管交辦事項

工作地點: 桃園市楊梅區中山北路一段199巷21號3F 或 桃園區幸福路202號8樓