Die Bond Process Engineer
Summary
Die Bond Process Engineer supporting semiconductor packaging operations in Kaohsiung, Taiwan — monitors production stability, performs root cause analysis on process issues, and supports new product introductions for die bond assembly.
**Key Responsibilities**
- Assist in establishing and maintaining the Die Bond process
- Monitor daily production to ensure process stability, yield, and quality performance
- Conduct root cause analysis (RCA) of process issues and implement corrective and preventive actions
- Support new product introduction (NPI), including process setup, validation, and documentation
- Optimize process parameters to improve yield, efficiency, and reliability
- Collaborate with cross-functional teams (e.g., Production, Equipment, Quality, Innovation)
- Analyze data and prepare process reports
- Participate in continuous improvement projects (e.g., cost reduction, capacity increase)
**Education & Qualifications**
- Bachelor’s or Master’s degree in a related field, including:
- Materials Science
- Chemical Engineering
- Mechanical Engineering
- Electrical / Electronic Engineering
- Basic knowledge of semiconductor packaging processes is preferred
- Strong analytical and problem-solving skills
- Good communication skills and a team-oriented mindset
- English proficiency: TOEIC score of 650 or above, or equivalent certification
More information about NXP in Greater China...