Director, Advanced Package Assembly and Test Engineering (Taiwan Supplier Development )

Introduction
We are seeking a Director-level Advanced Package Assembly and Test Engineering leader based in Taiwan to build, recruit, and lead a high-performing team of 5–6 advanced package assembly and test engineers. This leader will be co-located with the supplier in Taiwan and will serve as the primary technical and execution interface with the supplier, driving development work, engineering discipline, schedule acceleration, yield learning, failure analysis, and manufacturing readiness for advanced packaging programs.

Key Responsibilities
Build and lead a Taiwan-based team of 5–6 advanced package assembly and test engineers focused on supplier execution, development support, product qualification, and manufacturing readiness.

Serve as the senior technical and operational interface, driving day-to-day engineering alignment, issue resolution, development execution, and supplier accountability.

Lead advanced packaging assembly and test development activities across package architecture, process integration, NPI, qualification, reliability, yield improvement, and production ramp.

Establish rigorous engineering operating mechanisms with the supplier, including technical reviews, milestone tracking, risk management, data-driven problem solving, and clear escalation paths.

Drive rapid learning cycles for assembly and test development, with focus on reducing cycle time, improving yield, resolving quality issues, and accelerating customer program milestones.

Partner closely with internal product line, technology development, design, test, quality, reliability, procurement, and program management teams to ensure supplier execution is aligned to business and customer priorities.

Recruit, hire, coach, and retain top advanced packaging, assembly, test, and supplier engineering talent in Taiwan.

Develop the local team’s technical capability, supplier engagement model, and execution culture to support current programs and scale for future advanced packaging opportunities.

Lead root-cause analysis and corrective action for assembly, package integration, test, reliability, and yield excursions, including use of structured failure analysis and 8D methodologies.

Represent engineering leadership in supplier reviews, executive updates, customer program discussions, and cross-functional decision forums.

Required Qualifications

15+ years of experience in semiconductor packaging, assembly engineering, package development, test engineering, supplier engineering, or related advanced manufacturing roles.

Proven leadership experience managing engineering teams, ideally including direct responsibility for hiring, developing, and leading technical talent in Taiwan or the broader Asia semiconductor ecosystem.

Deep hands-on technical understanding of advanced package assembly and test processes, including one or more of WLCSP, fan-out wafer-level packaging, TSV, flip chip, Cu pillar, micro-bump, die attach, substrate-based packages, heterogeneous integration, or related advanced package technologies.

Strong experience working directly with OSAT suppliers, especially in Taiwan, with demonstrated ability to influence supplier priorities, engineering discipline, technical execution, and schedule performance.

Experience with NPI, qualification, process development, yield improvement, reliability testing, failure analysis, supplier audits, quality systems, and manufacturing ramp support.

Demonstrated ability to operate as a technical leader at the supplier site while also communicating effectively with senior internal stakeholders and customer-facing program teams.

Preferred Experience

Prior leadership role at or closely partnered with ASE, a major OSAT, IDM, fabless semiconductor company, or foundry with advanced packaging programs.

Familiarity with optical engine, silicon photonics, co-packaged optics, AI infrastructure, high-speed interconnect, or heterogeneous integration programs is a plus.