Director of Hardware Engineering for AI Infrastructure Systems
Posted Updated 1
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Summary
Build and lead Axelera AI's infrastructure systems engineering division, defining and shipping board- and system-level products (PCIe accelerator cards, OAM modules, baseboards, rack systems) from concept to mass production. Core tech spans PCIe/CXL, high-speed SerDes, power/VRM and thermal design, and BMC/platform firmware.
You will establish and lead an infrastructure systems engineering division. You will define board- and system-level product roadmaps, review designs, lead validation and production readiness, shape platform firmware and thermal strategies, and work directly with customers and manufacturing partners.
Responsibilities
- Build, structure and mentor a multidisciplinary infrastructure systems engineering organization.
- Define the roadmap for PCIe accelerator cards, OAM modules, baseboards and rack systems.
- Lead system implementation across schematics, PCB design, high-speed signaling, memory, power and thermal integration.
- Own execution from concept through validation, qualification and mass-production readiness.
- Drive BMC management, platform firmware, secure boot, RAS and telemetry engineering.
- Lead thermal and mechanical strategies for high-power accelerator platforms.
- Align board and system execution with embedded AI engineering leadership.
- Refine platform requirements with architecture, product, silicon, SDK and software stakeholders.
- Engage customers, integrators, hyperscalers, cloud operators and OEM/ODM partners.
- Define engineering processes, documentation standards, validation methods and quality gates.
- Resolve technical risks, escalations and root-cause investigations.
- Own engineering budget, capital expenditure, external spend and vendor relationships.
Requirements
- 15+ years of hardware engineering experience for complex electronics products.
- At least 5 years of senior leadership experience running multidisciplinary teams.
- Experience shipping datacenter- or server-class compute hardware into volume production.
- Expertise in PCIe, CXL, high-speed SerDes, server memory, power delivery, VRM design, PCB layout and SI/PI.
- Experience with BMC management, Redfish, IPMI, UEFI, BIOS, secure boot and RAS.
- Knowledge of datacenter thermal and mechanical design.
- Experience working with tier-1 CMs and ODMs.
- Ability to review schematics, layouts, simulations and lab validation data.
- Fluent English.
Benefits
- Pension plan.
- Employee insurances.
- Option to receive company shares.