Director, Power Package Design & SiP Engineering in , United States
This position is no longer accepting applications (closed Oct 26, 2026).
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Description
Renesas Electronics is seeking a senior packaging technology professional in the United States to lead the development of power SiP/module packaging and wafer-level technologies. You will drive design, qualification, and production ramp with OSAT/CM partners, ensuring quality and timely delivery for automotive, industrial, and data center markets. The role requires a PhD/masters/bachelor in engineering or physical sciences and 15–20 years of experience in packaging, with strong analytical and
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