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台灣立訊精密有限公司

Electronics Engineer – Reno/Sparks Manufacturing Facility

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Description

Key Responsibilities:
<NPI & Design Support>
Review customer schematics and PCB layouts for manufacturability and support New Product Introduction (NPI).
Work with DFM and product engineering teams to resolve design-related issues before production ramp.
Prepare process documentation, work instructions, and engineering change notices (ECNs).
Support product qualification, first-article inspection, and production trial runs.
<BOM & Component Management>
Maintain and review the Bill of Materials (BOM) for assigned products.
Evaluate component alternatives, second-source options, and obsolete component replacements.
Collaborate with procurement and planning to resolve component shortages, lifecycle issues, and supplier quality concerns.
Ensure component specifications are accurate and consistent with customer requirements.
<Production Support & Failure Analysis>
Troubleshoot and resolve electronic assembly defects on the SMT and PCBA production line.
Perform failure analysis (FA) using X-ray, microscopes, in-circuit testing, and cross-sectional methods.
Analyze escape points, root-cause issues, and drive corrective and preventive actions (CAPA).
Support first-pass yield improvement and track component-level ppm and defect rates.
<Process & Quality Improvement>
Apply IPC-A-610 acceptance criteria and support process optimization for solder paste printing, placement, reflow, and cleaning.
Work with quality engineers to define inspection standards and control plans.
Drive continuous improvement projects using Lean, Six Sigma, or other problem-solving tools.
Train production technicians and operators on electronic assembly standards and ESD requirements.

※Please note: Applicants must have valid US work visa or US citizenship.
※Accommodation provided

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