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Engineer, Field Process (Hillsboro, OR)

Open 23d posting dated last week

Summary

On-site engineer in Hillsboro, OR, who develops and transfers advanced semiconductor thin-film processes (ALD, PEALD, PECVD, epitaxy, LPCVD) for customers, troubleshooting and optimizing chip-manufacturing equipment.

Step into a career with ASM, where cutting edge technology meets collaborative culture.

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

Engineer, Field Process (Hillsboro, OR)

As a Field Process Engineer, you will help expand ASM’s advanced film technologies at a customer site in Oregon by developing, optimizing, and transferring innovative ALD, PEALD, PECVD, Epitaxy, and LPCVD processes. You will serve as the technical interface between customer engineering teams and ASM’s global Business Unit, ensuring smooth and successful introduction of new products and processes. This role directly supports ASM’s mission to accelerate next‑generation semiconductor manufacturing through collaboration, technical excellence, and strong customer partnerships.

What you will be working on

  • Support New Product Introduction (NPI) by training with the Business Unit to gain deep expertise in new deposition processes and hardware
  • Lead the introduction, qualification, and transfer of new processes to the customer site
  • Partner closely with field hardware engineers and Business Unit teams to troubleshoot new products and develop process or hardware improvement proposals
  • Design and execute on-site experiments with customers to support development, integration, and continuous improvement projects
  • Escalate technical issues in a timely manner to maintain scope, timelines, and customer alignment
  • Document key learnings during NPI and ensure effective knowledge transfer to local service and manufacturing teams
  • Analyze baseline system and process performance against technology‑node requirements to identify gaps
  • Perform structured problem solving and root‑cause analysis on process or system nonconformances
  • Collaborate with customer teams to identify and grow opportunities for ASM hardware and process adoption
  • Support process transfer to high‑volume manufacturing (HVM) fabs, creating and maintaining best‑known methods (BKMs) and documentation
  • Maintain strong discipline around IP boundaries, customer communication, and escalation leadership

What we are looking for

  • MS degree with relevant internship, research, or academic project experience, or PhD with relevant academic, research, or internship experience in materials science, chemical engineering, or physics
  • Hands-on experience processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, epitaxy, or LPCVD reactors through internships, research, or academic projects
  • Demonstrated troubleshooting and structured problem‑analysis skills (e.g., KT, FMEA, Ishikawa, 7‑step methodologies)
  • Experience designing, running, and interpreting DOEs or statistical experiments in academic, research, or internship settings
  • Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin‑film characterization
  • Willingness and ability to travel for training and customer engagement; flexibility to support extended hours or weekends during qualifications or escalations
  • Strong written and verbal communication skills with the ability to clearly explain technical concepts
  • Ability to maintain confidentiality and uphold IP boundaries

What sets you apart

  • Internship, research, or academic experience with ASM ALD, PEALD, PECVD, epitaxy, or vertical furnace LPCVD equipment
  • Demonstrated success optimizing deposition processes in research, pilot, or HVM‑adjacent environments
  • Exposure to customer‑facing technical discussions, presentations, or reviews
  • Experience supporting process transfer, scale‑up, or qualification activities
  • Proven ability to collaborate cross‑functionally and contribute to structured action plans during technical challenges or escalations

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at and on LinkedIn, Facebook, Instagram, X and YouTube.


ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

What this application asks

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  • Have you ever been employed with ASM before? choose one
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  • ASM may work with technologies subject to U.S. export control regulations. The following questions are being asked to comply with the regulation. This is required for all ASM positions, regardless of work location. This information will not be used for any other purpose than export controls. You may read more about this here: U.S. Export Administration Regulation (EAR) 15 C.F.R. § 730 -774. Please, select which option applies to you. choose one
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