Engineer, Process (Backend)
Summary
Backend process engineer in semiconductor IC packaging; develops and optimizes production workflows like SMT/SMD, reflow, and AOI to improve yield and cycle time.
Position Summary
The Process Engineer is responsible for development and establishment of production process.
Responsibilities
Responsible for Backend process: Pick and Place / SMT and SMD / Ball Drop / Reflow / Laser Marking / Tape and Reel / Singulation / Packing / AOI, etc.
Establish, review and update specifications, workflow, quality and safety related documentation for production line.
Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
Process sustaining and control through SPC and periodic defect Pareto Analysis.
Lead and drive SPC control.
Review and maintain FMEA, Control plan, OCAP with cross-functional teams.
Handle and manage customer audits and 8D reports.
Provide disposition for engineering and production lots.
Conduct process characterization and qualification to establish process baseline.
Coordinate and liaise with vendor/suppliers on process issue or quality issue.
Support customer NPI activities and internal engineering activities.
New material, process & machine development and qualification.
Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line
Any other ad-hoc duties as assigned by supervisor
Requirement
Minimum bachelor's degree in material science, microelectronics, mechanical engineering or relevant engineering field
At least 3 years of experience in semiconductor manufacturing industry and working in cleanroom environment
Hands-on process experience in Backend Process: Pick and Place / SMT and SMD / Ball Drop / Reflow / Laser Marking / Tape and Reel / Singulation / Packing / AOI, etc within semiconductor IC packaging industry
Experience in SPC, DPE, FMEA, OCAP, WI, CPK, PPK, 4D/8D report