Engineer, Process (Die Prep)
Position Summary
The Process Engineer (Die Prep) is responsible for development and establishment of production process.
Responsibilities
Establish, review and update specifications, workflow, quality and safety related documentation for Die Prep (Backgrind, Dicing, Laser Grooving, etc) processes within production line.
Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
Process sustaining and control through SPC and periodic defect Pareto Analysis.
Lead and drive SPC control
Review and maintain FMEA, Control plan, OCAP with cross-functional teams.
Handle and manage customer audits and 8D reports.
Provide disposition for engineering and production lots.
Conduct process characterization and qualification to establish process baseline.
Coordinate and liaise with vendor/suppliers on process issue or quality issue.
Support customer NPI activities and internal engineering activities.
New material, process & machine development and qualification.
Review and accept machine buyoff, setup pilot line process and transfer from pilot to production line
Requirements
Minimum Degree in Electrical & Electronics, Microelectronics, Mechanical engineering or relevant engineering discipline
Experience in Semiconductor manufacturing industry and working in cleanroom environment
Minimum 3 years hands-on Die Prep process such as Backgrind, Dicing, Laser Grooving within semiconductor / electronics manufacturing industry
Experience in SPC, DOE, FEMA, and 8D reports