ENGR I, MANUFACTURING EQUIP; MFG
Summary
Engineer responsible for maintaining and improving semiconductor assembly equipment, qualifying new processes, and collaborating with cross-functional teams to enhance yield and productivity.
Responsible for supporting Assembly manufacturing equipment, driving equipment reliability and leading New Product Introduction (NPI) activities for new package and product development.
• Support assembly equipment uptime, OEE and maintenance programs.
• Lead equipment qualification and readiness for NPI programs.
• Coordinate with Process, Product, Quality and Manufacturing teams.
• Develop machine recipes, tooling and process parameters.
• Support DOE, process characterization and improvement projects.
• Drive yield, cycle time and productivity improvements.
• Maintain engineering documentation and compliance requirements.
• Bachelor Degree in Engineering.
• 3–5 years semiconductor assembly experience.
• Experience with Die Attach, Wire Bond, Sintering, Molding, Singulation or related equipment.
• Familiar with SPC, FMEA, 8D and DOE methodologies.
• Strong analytical and communication skills.