封裝生產－助理技術員/日班
Posted Updated 17
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Description
封裝機台 (Die Bond / Wire Bond) 操作/目檢人員
1.具操作機台經驗、顯微鏡目檢經驗
2.基本電腦操作(Excel)
Requirements
學歷：高中以下、高中、專科、大學
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