Global Field Application Engineer (FAE) _(North America/Germany/DACH/Japan/TW)

Role Vision / 職位願景
As a Global FAE at Amphenol LTW, you are a "Technical Ambassador" connecting our engineering core with global R&D teams. You will be stationed in strategic markets to provide deep technical consultation, ensuring our leading interconnect solutions are precisely integrated into customer innovations.
作為 Amphenol LTW 的全球技術應用專家，你將是連結我們研發核心與全球客戶研發團隊的「技術大使」。你將駐點於關鍵戰略市場，提供深入的技術諮詢，確保我們的連接方案能精準轉化為客戶的產品優勢。

Your Mission: Technical Leadership & Regional Integration / 核心使命
Phase I: Technical Architecture & Design-in / 技術架構與設計導入

• Engineering Consultation: Engage in the early R&D phase to provide expertise on connector architecture, signal integrity, and material properties. Lead the Design-in process. 深入參與研發初期，針對連接器架構、訊號完整性與機構材料提供專業建議，主導 Design-in 流程。
• Solution Prototyping: Develop technical demos and reference designs tailored for sectors like Industrial Automation, Renewable Energy, and Marine Electronics. 針對工業自動化、再生能源與海事電子等領域，開發技術演示模型與參考設計。
• Technical Documentation: Author high-quality application white papers and technical notes to set authoritative standards for global clients. 撰寫高品質應用白皮書與技術手冊，為全球客戶建立權威技術規範。

Phase II: Strategic Regional Execution / 區域戰略執行

• North America (NA): Focus on High-Performance Computing (HPC), Data Centers, and compliance with specialized protection protocols.

北美： 專注於高效能運算、資料中心與特定防護協定規格。

• EMEA/DACH (German-speaking): Focus on Industry 4.0 compatibility and rigorous engineering certifications (DIN/VDE standards).

歐洲/德語區： 強調工業 4.0 兼容性與嚴謹的工程認證（如 DIN/VDE 標準）。

• Japan: Prioritize quality specifications, precision mechanical integration, and high-standard supplier technical collaboration.

日本： 重視品質規範細節、精密機構對接與高標準的供應商協作流程。

• Taiwan: Coordinate New Product Introduction (NPI) with ODM/EMS partners to bridge the gap between design and mass production.

台灣： 協調 ODM/EMS 代工廠的量產導入（NPI），解決從設計轉量產的技術盲點。

Who We Are Looking For / 理想人才條件
1. Professional Technical Background / 專業技術背景

• Bachelor’s or Master’s in Electronics, Electrical, or Mechanical Engineering. 電子、電機、機械工程或相關領域學/碩士。
• 3+ years in the electronics industry (EMS/ODM exposure). Familiarity with PCB layout, active/passive components, or mechanical design is highly preferred. 3 年以上電子產業經驗（熟悉 EMS/ODM 生態），具備 PCB 佈局、主/被動元件或機構設計知識者尤佳。
• Strong hands-on skills in reading technical drawings and onsite troubleshooting. 具備解讀技術圖紙與現場技術排錯（Troubleshooting）的實戰能力。

2. Global Communication & Linguistic Mastery / 全球溝通與語言能力

• English: Professional fluency; capable of conducting technical debates and solution presentations with international teams.

英語： 專業流利，能與國際團隊進行技術辯論與方案演示。

• Regional Languages:

o German: Preferred for the DACH region. / 德語： 德語區市場優先考量。
o Japanese: Preferred for the Japan market (familiarity with Japanese business etiquette). / 日語： 日本市場優先（需熟悉日商禮儀）。
o Mandarin: Essential for bridging communication with the Taiwan headquarters. / 華語： 作為與台灣總部溝通的核心橋樑。
o Second Languges: Spainish, Italiano etc. is plus.
3. Global Mobility & Mindset / 全球移動力與思維

• Cultural Intelligence: Ability to adapt to diverse engineering cultures across different regions. 具備跨文化適應力，能理解不同區域的工程工作文化。
• Mobility: Willingness to be stationed abroad long-term and travel regionally. 需長期駐點海外並接受區域性差旅。