Global 連接器龍頭｜Electronic Engineering Manager (Competitive Salary) - RH

📋 Job Responsibilities

• Global Team Leadership & Coaching: Manage, mentor, and grow a globally distributed team of electronic design engineers; drive technical standards, review frameworks, and career development pathways.
• End-to-End Electronic Design Mastery: Own schematic capture, component selection, BOM architecture, EEPROM configuration, PCB layout, stack-up design, and DFM/DFMEA execution to ensure maximum manufacturability and reliability.
• Strategic Cost & Value Engineering: Lead design-for-cost (DFx) initiatives, should-cost analysis, and supplier collaboration to balance signal integrity, thermal performance, product reliability, and aggressive margin targets.
• Cross-Functional & Customer Alignment: Partner closely with Signal Integrity (SI), Mechanical, Validation, Sourcing, Quality, and Product Management teams, while interfacing directly with global OEMs, ODMs, and Tier-1 hyperscale cloud customers.
• Technology Roadmap Drive: Translate emerging customer requirements and high-speed hardware trends (e.g., PCIe, high-density AI interconnects) into long-term product development strategies and next-gen hardware roadmaps.

🛠 Technologies & Core Concepts Used

• Hardware Architecture: Integrated Connector Modules (ICM), Internal Cables, High-Speed Interconnects, Magnetics, Riser Cables, High-Density PCB Stack-Up Architecture.
• Electronic Design & Tools: Schematic Capture, PCB Layout, EEPROM Configuration, BOM Architecture & Component Engineering, Signal Integrity (SI) Concepts, PCIe Interfaces.
• Engineering Management: DFM / DFMEA Practices, Design-for-Cost (DFx), Should-Cost Analysis, Value Engineering, EV/DV Validation Frameworks.

🎁 Benefits & Perks

• Global Executive Exposure: Direct influence over multi-national engineering footprints, regularly interfacing with top-tier global AI, cloud, and datacenter customers.
• High-Impact Product Portfolio: Own the core electronic architecture powering the next generation of AI supercomputing, high-speed servers, and cloud infrastructure.
• Competitive Executive Compensation: Package is open to negotiation (面議), offering highly competitive base pay, performance bonuses, and bespoke leadership incentives.

Requirements

🎯 Requirements & Skills

• Education: Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, or a related STEM field.
• Leadership Experience: 5+ years of hands-on electronic design experience with proven management or mentorship leadership over electronic design engineers.
• Technical Mastery: Deep operational command of electronic product development—from initial concept through schematic design, component selection, PCB layout, DFM/DFMEA, validation, and mass production release.
• Supply Chain & Financial Acumen: Strong proficiency in BOM management, component engineering, cost-structure evaluation, and supplier technical alignments.
• Language & Global Communication: Professional, fluent English proficiency (listening, speaking, reading, and writing) is mandatory. Proven ability to articulate complex electronic design concepts to global stakeholders, ODMs, and hyperscale customers.

🌟 Preferred Qualifications (What Will Put You Ahead)

• High-Speed Architecture: Direct experience with high-speed electronic design, Signal Integrity (SI) concepts, and PCIe or related high-speed interfaces.
• Domain Expertise: Hands-on experience with ICM products, magnetics, internal cables, or high-speed connector solutions within AI, datacenter, server, storage, or networking ecosystems.
• Global Operations: Proven track record in cost engineering, value engineering, supporting high-volume manufacturing, and leading globally distributed engineering teams.