Hardware Development Engineer

Summary

Thermal design and simulation engineer for high-speed pluggable optical transceivers, running FloTHERM simulations, correlating with lab measurements, and driving thermal architecture decisions across cross-functional teams.

As an Hardware Development Engineer, you will play a crucial role in the NI ON PSE HW&TE GX Syst HW & CentEng 5 (L06) department. Your primary focus will be on thermal design, simulation, and optimization for a range of high-speed pluggable transceivers, ensuring they meet power, temperature, and reliability requirements. You will collaborate with various teams and drive thermal architecture decisions throughout the product development lifecycle.

NILightpath

  • Own thermal design, simulation, and optimization for OSFP, OSFP-XD, QSFP-DD, QSFP112, QSFP56, CFP, and future form factors.
  • Develop thermal solutions for modules supporting 25G to 1.6T applications, ensuring compliance with specifications.
  • Collaborate with mechanical, signal integrity, optics, electronics, manufacturing, and reliability teams.
  • Select and optimize thermal solutions such as heat spreaders, sinks, vapor chambers, and heat pipes.
  • Understand and manage module-to-cage thermal interfaces and host-system cooling interactions.
  • Perform thermal simulations using FloTHERM and other thermal analysis tools and optimize airflow paths, pressure drops, and component temperatures.
  • Correlate simulation results with lab measurements and drive design improvements.
  • Conduct thermal validation and testing, including thermal characterization, airflow analysis, and power dissipation testing.
  • B.E./B.Tech/M.E./M.Tech in Mechanical, Thermal, Aerospace Engineering, or related field.
  • 3+ years of electronics cooling and thermal engineering experience.
  • 2+ years of thermal design for pluggable optical modules (OSFP, QSFP-DD, CFP, SFP family).
  • Strong understanding of thermal challenges in DSP/ASIC cooling, optical engines, and laser devices.
  • Experience with FloTHERM and other thermal tools for thermal simulations and modeling.
  • Ability to correlate simulation results with lab measurements and drive design improvements.
  • Hands-on experience with thermal validation for optical transceivers or compact networking products.
  • Proficiency in thermal validation tools and techniques, including thermocouples and IR imaging.
  • Strong analytical skills, methodical approach, and excellent technical reporting abilities.

See also

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