HBM Product and System Engineer, R&D HBM 研發產品工程師

RESPONSIBILITIES

• Lead the technical introduction of HBM products from development through to mass production (NPI → HVM).
• Analyze the electrical, packaging, and system performance of products to ensure they meet building and customer requirements.
• Collaborate with process, process integration, and build teams to resolve product-related issues.
• Carry out yield analysis and increase product reliability.
• Assist with customer or system-level requirements (e.g., AI/GPU applications) and improve product performance.

REQUIREMENTS

• Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent experience.
• Proven experience in memory product development and mass production.
• Strong analytical abilities with the capability to assess product electrical, packaging, and system performance.
• Excellent collaboration skills to work effectively with cross-functional teams.
• Skill in carrying out yield analysis and promoting improvements in product reliability.
• Experience providing support for customer or system-level requirements, emphasizing AI/GPU applications.