(Ipoh/Malaysia)Test Integration Engineer [測試整合工程師]
Summary
Winbond Electronics is hiring a Test Integration Engineer at its Chemor (Ipoh area), Perak, Malaysia site. Day to day, the engineer analyzes and maintains semiconductor product test yield, supports new product introduction and validation, optimizes test parameters, and releases test equipment and programs to drive production quality and efficiency.
【Job Responsibilities】
As a Test Integration Engineer at Winbond, you will analyze and maintain product test yield, support new product introduction and process validation, and drive yield and quality improvement for production products. Responsibilities include test parameter optimization, test yield improvement and abnormality analysis, test equipment and program release, support for production efficiency and quality improvements, implementation of quality management and EHS practices, and engineering support for wafer test experiments.
【Qualifications】
Educational Requirements：大學
Major Requirements：電機電子工程相關 │ 工程學科類(全部)
Relevant Experience：3年以上
Language Proficiency：英文 優級 中文 優級
Management Responsibilities：No
Shift Work Requirements：No
Travel Requirement：未定
Overseas Assignment Requirements：No
Other：
Candidates with experience in test integration are preferred.
【Work Location】
Ipoh (No 5A Jalan Klebang 1/5, Zon Perindustrian Bebas Kinta, Jalan Kuala Kangsar, 31200 Chemor, Perak Malaysia)