Manufacturing Engineer 半導體製造工程師 - Location : Tainan

請上官網投遞履歷:https://careers.appliedmaterials.com/careers/job/790317189268

■ About EPG (Equipment Product Group)

Equipment Product Group (EPG) is a business unit within Applied Materials' WWO (Worldwide Operations) organization. EPG focuses on the manufacturing, refurbishment, upgrade, and lifecycle support of semiconductor equipment, particularly 200mm and legacy platforms. The team works closely with global customers to improve equipment productivity, extend tool life, and support growing markets.

■ Key Responsibilities

1. Role requires technical knowledge and experience of EPG 200mm product and structure.
2. Solve complex technical challenges to enable stable, high-volume manufacturing and drive design improvements that ensure product reliability.
3. Partner closely collaboration with cross-functional team to ramp up manufacturing capabilities for building, integration and testing modules and establish robust manufacturing processes. Including highlight & key focus, project and priorities to support manufacturing performances.
4. Excellent reading & understanding of the manufacturing drawings. Use basic engineering and design 3D modeling tool (DFx/Solid works/NX/AutoCAD/Inventor) principles to estimate and reduce manufacturing and/or product costs, and to improve product quality
5. Determine time standards, and make recommendations for tooling and process requirements

■ Minimum Qualifications:

1. Bachelor’s degree
2. 2-4 years of engineering experience in the semiconductor industry. Applied Materials tool experience with hardware expert is preferred.
3. Tool: MDP and ETCH is plus

■ Preferred Qualifications:

1. Strong conceptual knowledge and technical experience for everyday problem-solving on the job
2. Solid interpersonal skills, and the ability to clearly explain complex information to others