Mechanical and Thermal Analysis of Advanced Packaged Devices Intern
Summary
Intern in AMD’s Singapore lab analyzing mechanical and thermal performance of advanced semiconductor packages using MATLAB, Python, and experimental design.
As an AMD [intern/co-op], you’ll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers. You’ll do important work, learn new skills, expand your network, and gain real-world experience on projects that impact millions of end-users worldwide. Whether you’re an undergrad or a PhD student, your contributions matter—and your experience here will be a launchpad for what comes next.
- Hands-on experience with mechanical and thermal analysis techniques applied to advanced semiconductor packages.
- Practical skills in designing experiments, collecting and analyzing data using tools like MATLAB and Python.
- Exposure to cross-functional collaboration in a high-tech R&D environment.
- Insights into the challenges and innovations in advanced packaging technologies.
- Professional development through technical presentations and documentation.
- Design and execute experiments to assess mechanical and thermal characteristics of semiconductor packages.
- Analyze experimental data using MATLAB, Python, Excel, or other relevant tools.
- Collaborate with cross-functional teams to optimize experimental setups and ensure data accuracy.
- Present findings to internal stakeholders and participate in technical discussions.
- Continuously refine experimental procedures and maintain clear documentation.
- Pursuing or graduating within a year with an advanced degree (Master’s or PhD) in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Strong analytical skills and experience with data analysis tools (e.g., MATLAB, Python, Excel).
- Familiarity with thermal and mechanical characterization techniques is a plus.
- Excellent communication and presentation skills.
- Ability to work independently and in a team-oriented environment.
- Electrical Engineering, Materials Science, or Materials Engineering preferred.