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美商艾科斯羅國際股份有限公司台灣分公司

Mechanical Engineer III (Thermal)

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Description

*English resume is required*

Position Summary:

Mechanical Engineering position focusing on the design of automation equipment for the semiconductor test industry. Candidate must have a proven track record in innovating and successfully deploying mechanical / thermal automated solutions. The position requires leading engineering efforts related to complex thermal mechanical systems for new product introduction and expanding the capabilities of existing product lines. Must have a can-do attitude, self-motivated and researches and identifies state of the art technologies for design and applications.
Cohu is a world leader in semiconductor handling equipment used to test ICs under temperatures ranges from -55°C to +175°C.

Essential Functions/Major Responsibilities:

1. Perform analysis to determine if specifications are realistic and estimate risk exposure: thermal dynamics, computational fluid dynamics (CFD), thermal / mechanical finite element analysis (FEA), mean time between failure (MTBF) and failure modes and effect analysis (FMEA), or other mathematical models.
2. Participate or manage in all development phases of assigned projects, including requirement definition, design, test, integration, deployment and support.
3. Ability to develop and maintain project requirements, specifications, detailed plans.
4. Track the progression of the projects to ensure on-time completion and delivery while adhering to the product development processes.
5. Interface directly with operations, sales and customers as well as other Cohu Businesses as required.
6. Other duties as assigned.

Supervisory Responsibility:

1. Provide work leadership and training to lower level technical or professional employees.
2. Assigned responsibility to supervise lower-level engineering personnel during project execution.

Skills

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See also

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