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捷康半導體有限公司

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【美商】資深維修工程師 (BWL DA封裝)

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Description

1. Familiarized with Cu Wire Bonding process optimization.
2. Responsible for qualification lot build.
3. 8D method to solve process issue.
4. New process, new material development with the best quality, yield for mass production.
5. To achieve the company goals of best quality, yield, delivery and reliability on all relative products.
6.Debug machine problems & review machine troubleshooting record routinely and provide immediate/preventive action to meet production output
7.Modified machine capability/function to meet planning schedule for any conversion of part number or package change by well producing/controlling spare parts.
8.Maintenance experience sharing for knowledge succession to upgrade the technical level of maintenance technicians
9.Install and buy off new equipments to expend package capacity and sustain new process/product implementation
10.Provide relative information of all equipments / tools as an operation standard & enhance higher standard of safety in machine operation

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