Memory Packaging Technical Manager

Product 2.5D/3D/3.5D heterogeneous package development, LPDDR/HBM/IPM development for advanced package, product memory roadmap, package memory architecture , customized HBM development

#LI-JK1

1. >10yrs DRAM (LPDDR/HBM..) technical experience, RD is a plus.
2. Familiar with memory design, architecture, process, packaging, materials…
3. Project handling experience