Microelectronics Assembler – Hybrid Thick-Film

Position Summary

The Microelectronics Assembler performs precision assembly and processing of hybrid thick-film microelectronic components in a Class 10K cleanroom environment. This position involves working with delicate, lightweight components and ceramic substrates using microscopes, precision tools, and specialized manufacturing equipment.

The ideal candidate has strong manual dexterity, excellent attention to detail, and the ability to follow detailed work instructions while maintaining high standards of workmanship and quality. Experience in microelectronics or precision manufacturing is preferred, but candidates with the appropriate skills and aptitude may be considered.

Key Responsibilities

• Perform precision assembly of hybrid thick-film microelectronic components using microscopes, tweezers, and specialized hand tools.
• Handle extremely lightweight and delicate components with care to prevent damage, contamination, or defects.
• Perform microelectronic assembly processes, including die attach, die bonding, wire bonding, soldering, and epoxy dispensing, as required.
• Print and fire ceramic substrates in support of thick-film circuit manufacturing.
• Operate specialized microelectronics equipment, including wire bonders, dispensing equipment, ovens, and inspection tools.
• Follow detailed work instructions, engineering drawings, process specifications, and manufacturing travelers.
• Inspect components and assemblies under magnification to verify workmanship and conformance to quality requirements.
• Accurately document completed operations, inspection results, and production records.
• Work with engineering and quality personnel to address manufacturing issues and maintain product quality.
• Maintain cleanroom protocols, electrostatic discharge (ESD) controls, and applicable safety requirements.
• Maintain a clean, organized work area and comply with established contamination-control procedures.
• Perform other related manufacturing duties as required.