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MTS/ Engineer, Equipment

Summary

Lead the setup and optimization of advanced semiconductor packaging equipment, troubleshoot hardware issues, and improve equipment reliability and yield for next-gen fanout packaging.

Position Summary

The Equipment Engineer/ MTS will provide technical leadership to startup of next generation of Fanout packaging equipment, optimize equipment capability, quality, and utilization through CIP to meet company's goals.

Responsibilities

  • Have an in-depth understanding of how process equipment working principle and how critical parameters will impact process and to work together with process counterpart to resolve complex integration issues.
  • Manage and plan new equipment start-up to support production, from facilities hookup, vendor startup, to acceptance of equipment for production
  • Establish Preventive Maintenance (PM) plans for all equipment and optimize PM for quality, cost, and productivity.
  • Liaise with vendors to resolve equipment issues and improve equipment performance of equipment to enhance quality, yield, cost reduction and productivity.
  • Identify and assess any safety and product risks, recommends risk eliminations, and control risk through mitigations and safe work procedures.
  • Initiate meeting with both process and manufacturing Engineers to ensure work is carried out efficiently to meet group objectives
  • Lead and implement equipment improvement projects to improve equipment efficiency, cost reduction and reliability of equipment
  • Forecast financial budgets for equipment expenditures. Setup tracking system to monitor expenditures
  • Set targets, goals, and projects for the section to minimize scrap, equipment cost, optimize equipment capability and utilization to meet operational needs
  • Provide feedback / training to AEs and TAs on their troubleshooting skills, equipment knowledge, decision making, risks assessment
  • Familiar and follow up on SPSR, MRB, 8D, TECN, ECN ISO9001/QS9000/TQM documentation for closure of issues / setup system.
  • Self-audit and update specifications to meet company Quality Standard requirements
  • Set expectation and carry out performance appraisal for Technician or AE as instructed by Manager. Help the AE or Engineer on their career path development
  • Provide long term solution to address daily issues. Resolve department hardware chronicle issues.
  • Possess knowledge on SPC, DOE, FDC, ECMS and all the statistical analysis tools to help optimizing equipment robustness.
  • Able to coach Engineers in performing hardware trouble shooting.
  • Establish stock levels of essential spare parts and consumables to support equipment maintenance based on forecasted manufacturing volume. Liaise with vendors to minimize / eliminate over-stock or under-stock

Requirements

  • Bachelor Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering
  • Diploma candidates with min 8 years of work experience in similar role
  • At least 5 years of relevant experience in equipment engineering for senior level, preferably in a semicon/LCD industry
  • Hands-on experience in equipment maintenance or troubleshooting.
  • Self-driven leader and strong team player with keen technical ability, systematic approach, detailed-oriented, excellent problem-solving with strong analytical skills.
  • Proven ability to identify, assess and solve problems
  • Ability to work under pressure & in a Dynamic Environment
  • Wafer-level Fanout /WLCSP packaging experience

- Die preparation: Backgrind, Dicing, Laser-grooving

- Recon: Die PNP / Molding/ De-bonding

- Experience working with high precision die-bonder flip chip bonder like Datacon Chameo/ Nucleus

See also

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